| | | | | | | | | | | | | | | | | | | | Packaging and Development |
| | | | | | | | | | | |
|
|
|
|
|
AMD Statement on Pb (Lead) Phase-Out
Processor Pb-reduction Plan
Lead in electronic products has come under increased regulatory scrutiny because of the growing number of electronic products requiring end of life treatment and disposal. In addition, AMD customers are requesting information on lead-free products, and the European Community has established a July 1, 2006 phase-out date for lead in electronic products, with some exceptions. As a result, AMD has initiated a lead-free research and development program, and is working with suppliers and other companies to establish lead-free standards and testing requirements and to identify possible substitutes.
Small amounts of lead are contained in AMD components in Ball Grid Array/Fine-Pitch Ball Grid Array (BGA/FBGA) solder balls, the external plating on leadframe packages, solder pastes, and flip chip solder bumps inside the semiconductor package. Overall, lead in semiconductors is a very small fraction of the lead used by industry.
- AMD is participating in key industry consortia (National Electronics Manufacturing Initiative, Inc. [NEMI], High Density Packaging Users Group [HDPUG], and is working with universities (Georgia Tech, Northwestern University) and trade associations (American Electronics Association [AeA], Electronic Industries Alliance [EIA], Semiconductor Industry Association [SIA], European Semiconductor Industry Association [ESIA]) in order to develop specifications, and an industry definition for “lead-free” products.
- AMD products identified as lead-free may contain lead as an impurity at industry-accepted concentrations defined in IPC/EIA J-STD-006A (May 2001), section 3.3.
- Our lead reduction/elimination program is consistent with worldwide industry practice. AMD began defining alternatives for production of lead-free packaging in 2001, and plans to offer lead-free products according to customer demand. In some cases, a limiting factor for AMD’s program may be the availability of drop-in materials or replacement assembly tool sets.
- AMD depends on its customers for information on their lead-free requirements. Meeting customer functionality and reliability requirements for their products, has been and will continue to be an important consideration.
- AMD supports the lead-free exemption for high melting temperature solder because of the decreased functionality and reliability of substitutes. AMD uses this solder in flip-chip assembly for microprocessors.
- AMD supports the tailored control of lead use for environmental and health reasons. Chemical regulations should be based on an understanding of the consequences of the regulation, including the environmental and health impacts of possible substitutes.
- For further information, please contact: pb.free@amd.com
|
|
|
|
|
