| | | | | | | | | | | | | | | | | | | | Packaging and Development |
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Development Activities
Planning
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Status: Completed
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Phase 1: Evaluation of Current Packages and Materials
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Status: Completed
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- Assessment of current packages with 260°C reflow (complete)
- Include material and device compatibility
- Use NEMI reflow profile for preconditioning
- Selection of packages for evaluation (17 types)
- Package reliability testing
- Failure analysis
- Assessment of Pb-free lead finish options complete
- Available plating processes
- Compatibility with eutectic and Pb-free board assembly
- Cost and feasibility of implementation
- Assessment of Pb-free solderball options complete
- Assessment of subcontractor strategy and readiness
- Recommend options for production development
Phase 2: Development of Fully Pb-free Packages
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Status: Started Q2'03
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- Define development plan
- Identify material changes required
- Define new solderball/leadfinish candidates
- Define reliability requirements
- Develop manufacturing processes
- Demonstrate capability for package qualification
Phase 3: Production Implementation
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